SAN JOSE, Calif., Sept. 30, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), a leader in invention of semiconductor technology, announced that several of its semiconductor technologists will ...

A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

NEW YORK--(BUSINESS WIRE)--Olaplex Holdings, Inc. (“OLAPLEX”), the innovative, science-enabled, and technology-driven haircare company, today announced the launch of the brand’s new patented OLAPLEX ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...

OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of ...

Adeia has filed a pair of patent infringement lawsuits against AMD in the U.S. District Court for the Western District of Texas, claiming that AMD’s chips incorporate patented innovations covered by ...

Medical Manufacturing Technologies has acquired Innova Design, expanding its foothold in the bonding technologies industry. Innova Design specializes in laser bonding industry innovations, and ...