TOKYO--(BUSINESS WIRE)--Toshiba Corporation (TOKYO:6502) announced today that the launch of "CIPS183BS210", a Contact Image-Sensor Module with a faster data rate, for application in banknote ...
WATERLOO, Canada, July 09, 2024 (GLOBE NEWSWIRE) -- Teledyne DALSA is pleased to announce that its AxCIS™ family of high-speed and high-resolution fully integrated line scan imaging modules are now ...
WATERLOO, Ontario, Sept. 27, 2022 (GLOBE NEWSWIRE) -- Teledyne DALSA is pleased to introduce AxCIS™, a new family of high-speed and high-resolution fully integrated line scan imaging modules. These ...
WATERLOO, Ontario, Nov. 30, 2023 (GLOBE NEWSWIRE) -- Teledyne DALSA is pleased to announce that its AxCIS™ family of high-speed and high-resolution fully integrated line scan imaging modules are in ...
The Apple iPhone brought the benefits of integrated multi-sensor technology to the masses, and while the application of sensors and their associated algorithms has multiplied and changed the world ...
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