A new technique could solve one of the biggest challenges in making future computer chips from ultrathin materials. Researchers found that coating molybdenum disulfide with oxygen or fluorine lets manufacturers remove just the top layer of atoms much more safely during plasma processing.

Inside computer chips are billions of tiny transistors made from silicon. But the material is approaching its limits. In an effort to build smaller, more capable devices, researchers are exploring how they might build transistors with other materials alongside silicon,

A simple surface coating could make it easier to reliably make parts of next-generation computer chips using silicon and a promising new class of materials called transition metal dichalcogenides (TMD).

Putting the silicon membranes on the receiving wafer. (University of Illinois Urbana-Champaign) In recent years, computer chip performance has bumped up against the physical limitations of the space available on integrated circuits.

President Donald Trump’s ambiguous plans for 100% tariffs on computer chips that aren’t made in the U.S. are stoking confusion among businesses

Current copper wiring in computer chips struggles to carry electricity efficiently as circuits shrink to the nanoscale, leading to a process that generates heat and limits performance. These materials could make future chips faster, more energy-efficient ...