Beverly, Mass. – Clare Inc.'s line card access switch family is now available in micro lead frame packages (MLPs). The monolithic-IC replacements for 2 Form C electromechanical relays were previously ...
For many recent generation power semiconductors, package innovation makes a significant contribution to key performance parameters. In the case of HV MOSFETs, high-speed hard-switching transitions are ...
The new products are the first in Toshiba’s SiC MOSFET line-up to use the four-pin TO-247-4L(X) package, which allows Kelvin connection of the signal source terminal for the gate drive. The package ...
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