Headmade Materials qualifies Sinterit Lisa X for the ColdMetalFusion process, enabling efficient metal additive manufacturing ...
Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
VENTURA, Calif.--(BUSINESS WIRE)--Nexa3D, the ultrafast polymer 3D printing leader, announced today at Formnext, the immediate availability of its QLS 260 industrial laser sintering system as well as ...
Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...
The Korea Research Institute of Standards and Science (KRISS) has developed a key materials technology that accelerates the ...
Researchers at the Paul Scherrer Institute PSI have achieved a breakthrough on the path to practical application of lithium metal all-solid-state batteries—the next generation of batteries that can ...
Innovations in alumina ceramic production techniques can increase the utilization of alumina ceramics in industrial applications. For instance, simple alumina components, such as alumina discs, can be ...