The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's EMIB technology.

Shares of Intel (INTC) rose on Monday amid growing optimism that the chipmaker could secure a significant new customer for ...

The company is reportedly working with South Korea’s SK Hynix on new chip-packaging technology.

Intel (NASDAQ:INTC) shares rose more than 2% on Monday morning after a report said the chipmaker is working with SK hynix on advanced packaging technology used in high-end semiconductors. The report ...

Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data center sectors.

Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of the decade for both Intel and Intel Foundry customers, the company believes ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

TL;DR: Intel has restructured its glass substrate workforce, shifting from in-house development to off-the-shelf solutions, signaling a major strategic change under CEO Lip-Bu Tan. This move follows ...

SK Hynix stock soars 171% in 2026 on HBM demand; company pursues UAE sovereign wealth deals and Intel EMIB packaging to ...

Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential withdrawal amid ...