HSINCHU, Taiwan–Taiwan Semiconductor Manufacturing Co. Ltd. here today announced the start of wafer-bumping production services, which place solder contracts across the surface of processed silicon ...

Siliconware Precision Industries Co. Ltd. (SPIL) today said it has inked a licensing deal with Willow Grove, Pa.-based Kulicke & Soffa Industries Inc. and it's Phoenix-based Flip Chip Technologies ...

MUNICH, Germany--(BUSINESS WIRE)--SUSS MicroTec (FWB:SMH) (GER:SMH) announced that it has shipped and successfully installed a 300mm production lithography tool order at Amkor Technology, Inc.

PLAINVIEW, N.Y., Feb. 12, 2019 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer ...

Silicon Precision Industries (SPIL) and Xilinx jointly announced the successful development of 12-inch wafer solder bumping for flip-chip packaging. With Xilinx as technology partner, SPIL began to ...

Taiwan-based Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd (SPIL) have dived into 12-inch wafer bumping volume production, but Orient Semiconductor Electronics (OSE ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, has licensed advanced packaging technology from Deca Technologies and has taken ...

Interconnect, a wafer bumping service company, announced qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications, producing bonds that are stable at high ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...

TSMC is reportedly bumping wafer prices to $25,000 for 2nm chips. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. TSMC is reported to be upping ...

The initial round of stacked 2.5D and 3D chips based on through-silicon vias (TSVs) has emerged in the market. There are other 2.5D/3D chips in the pipeline, but it’s taking longer than expected to ...

SAN JOSE, Calif., Nov. 28, 2018 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announces that its industry leading Thermal Test Chip (TTC) will soon be available in 8" (200mm) diameter ...