Pulsonix has introduced a direct interface with ADAM Research's TRM software, streamlining thermal simulation for PCB designers. As electronics shrink and power up, TRM's advanced modeling helps ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

Dublin, July 07, 2025 (GLOBE NEWSWIRE) -- The "Global Market for Thermal Management Systems and Materials for Advanced Semiconductor Packaging 2026-2036" report has been added to ...

Cost-effective in-rack systems enable testing of standard 30kW or 50kW NeuCool liquid-cooled racks without multi-million-dollar hardware investments Custom testing configurations available, including ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...

The Xe-100 is a 200MWt Advanced Pebble Bed Reactor that will be deployed in Washington State in the 2028 timeframe with the support of the US DOE Advanced Reactor Demonstration Program. The Xe-100 has ...

Discover how heat resistant materials and material science innovations help electronics manufacturing manage rising temperatures, boost reliability, and enable smaller, more powerful next‑generation ...