Intel is at once a customer and a competitor to TSMC, which enjoys the enviable position of being the sole maker of the most high-end chips for Apple Inc. and Nvidia Corp Intel Corp. Chief Executive ...

Forbes contributors publish independent expert analyses and insights. Ollie Barder covers Japanese pop-culture and gaming from Tokyo. Released back in 1998, R-Type Delta was the first entry in the ...

Wei-Jen Lo, former senior vice president of Corporate Strategy Development at TSMC, who retired in July 2025, is reportedly being courted by Intel to head its R&D division. However, former TSMC ...

In the age of cloud computing, protections baked into chips from Intel, AMD, and others are essential for ensuring confidential data and sensitive operations can’t be viewed or manipulated by ...

If you told me 25 years ago that Intel would end up in decline, that Nvidia would buy a chunk of the ailing company, and that the two would partner to build chips that integrate Intel x86 CPU cores ...

Intel execs have made some strong statements about its Nova Lake processors, including that they expect the chips to recover the "leadership" position in the desktop PC market, and based on the leaks ...

In context: For now, Intel holds the title of the world's biggest spender on chip research and development – a distinction that underscores both its ambition and its struggle. But Nvidia is closing in ...

The U.S. government could take equity stakes in more companies, potentially through an American sovereign wealth fund, according to one of President Donald Trump's top economic advisers. National ...

Your nightmares, now in high-definition! R-Type Delta: HD Boosted brings back the dark, iconic shooter with modern enhancements, new music, razor-sharp graphics, and all the intensity you remember.

Fox News’ “The Five” panel members erupted Thursday as Kellyanne Conway and Jesse Watters pushed back on co-host and Democrat strategist Jessica Tarlov after she called newly declassified documents on ...

Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data center sectors.